A heat shock transcription factor gene (HaHSFA1) from a desert shrub, Haloxylon ammodendron, elevates salt tolerance in Arabidopsis thaliana

发布时间:2022-09-05 字体大小 T |T

Title: A heat shock transcription factor gene (HaHSFA1) from a desert shrub, Haloxylon ammodendron, elevates salt tolerance in Arabidopsis thaliana

Authors: Xin-Pei Lü, Kun-Zhong Shao, Jia-Yi Xu, Jia-Lü Li, Wei Ren, Jia Chen, Ling-Yu Zhao, Qi Zhao, Jin-Lin Zhang*

Journal: Environmental and Experimental Botany

Impact Factor: IF2021 = 6.02

Abstract: Haloxylon ammodendron is a typical desert xerophyte with worthy genetic resources, therefore, it is necessary to explore the resistance genes of H. ammodendron, and to improve the stress tolerance of other plant species through genetic engineering. In this study, a heat shock transcription factor gene, HaHSFA1, was firstly cloned from H. ammodendron and overexpressed in Arabidopsis thaliana. The sensitivity of transgenic plants to exogenous ABA, osmotic stress and salt stress were analyzed; the effects of overexpression of HaHSFA1 in Arabidopsis on salt tolerance were deeply investigated. The results indicated that overexpression of HaHSFA1 increased chlorophyll content in Arabidopsis, and the growth of plants was promoted. The leaf soluble sugar and proline contents in OE lines were significantly increased compared with those in WT. OE lines maintained lower osmotic potential and higher shoot water content. Overexpression of HaHSFA1 in Arabidopsis also enhanced antioxidant activity, which may be important for protecting plasma membrane integrity in cells. Overexpression of HaHSFA1 in Arabidopsis improved root activity and increased selective absorption and transport capacity for K+ over Na+, which was of great significance to reduce the toxic effect of Na+. This study indicated that overexpression of HaHSFA1 from H. ammodendron significantly elevates the salt tolerance of Arabidopsis, and HaHSFA1 has potential application values in improving abiotic stress tolerance in crops by genetic engineering.

Linkage: https://doi.org/10.1016/j.envexpbot.2022.104954